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ZXMP2120G4
PACKAGE OUTLINE
PAD LAYOUT DETAILS
3.8
0.15
2.0
0.079
2.0
0.079
6.3
0.248
1.5
0.059
2.3
mm
inches
0.091
Controlling dimensions are in millimeters. Approximate conversions are given in inches
PACKAGE DIMENSIONS
DIM
Millimeters
Inches
DIM
Millimeters
Inches
Min
Max
Min
Max
Min
Max
Min
Max
A
A1
-
0.02
1.80
0.10
-
0.0008
0.071
0.004
e
e1
2.30 BSC
4.60 BSC
0.0905 BSC
0.181 BSC
b
b2
C
D
0.66
2.90
0.23
6.30
0.84
3.10
0.33
6.70
0.026
0.114
0.009
0.248
0.033
0.122
0.013
0.264
E
E1
L
-
6.70
3.30
0.90
-
7.30
3.70
-
-
0.264
0.130
0.355
-
0.287
0.146
-
-
? Zetex Semiconductors plc 2005
Europe
Zetex GmbH
Kustermann-park
Balanstra?e 59
D-81541 München
Americas
Zetex Inc
700 Veterans Memorial Hwy
Hauppauge, NY 11788
USA
Asia Pacific
Zetex (Asia) Ltd
3701-04 Metroplaza Tower 1
Hing Fong Road, Kwai Fong
Hong Kong
Corporate Headquarters
Zetex Semiconductors plc
Zetex Technology Park
Chadderton, Oldham, OL9 9LL
United Kingdom
Germany
Telefon: (49) 89 45 49 49 0
Fax: (49) 89 45 49 49 49
europe.sales@zetex.com
Telephone: (1) 631 360 2222
Fax: (1) 631 360 8222
usa.sales@zetex.com
Telephone: (852) 26100 611
Fax: (852) 24250 494
asia.sales@zetex.com
Telephone (44) 161 622 4444
Fax: (44) 161 622 4446
hq@zetex.com
These offices are supported by agents and distributors in major countries world-wide.
This publication is issued to provide outline information only which (unless agreed by the Company in writing) may not be used, applied or reproduced
for any purpose or form part of any order or contract or be regarded as a representation relating to the products or services concerned. The Company
reserves the right to alter without notice the specification, design, price or conditions of supply of any product or service.
For the latest product information, log on to www.zetex.com
ISSUE 2 - SEPTEMBER 2006
6
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